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Master’s programmes at transnational higher education institutions in China: who enrols and why?

  • Dandan Huang
  • , Huan Li*
  • , Mei Lai
  • *Corresponding author for this work
  • Academy of Future Education
  • Suzhou University

Research output: Contribution to journalArticlepeer-review

Abstract

Studies have extensively documented student motivations for enrolling in transnational higher education (TNHE). However, most research focuses on undergraduates, leaving motivations for postgraduate enrolment largely unexplored. These programmes are of strategic importance in preventing ‘brain drain’ and have expanded steadily over the past decade. This study, based on interviews with 24 master’s students from two TNHE institutions in China, employs a refined push–pull model to explore factors influencing their choices. Findings reveal that higher degree requirements in the labour market, a desire for career advancement through upgrading their qualifications, and low academic preparedness for high-stakes exams pushed students toward TNHE for master’s degrees. Furthermore, three student groups with distinct push–pull factors were identified. ‘Working professionals’ and ‘internationally-educated graduates’ both emphasised family bonds, while the latter were also accustomed to Western-style education, both factors acted as pushes. ‘Escape route seekers’ (mainly recent domestic graduates) were pushed by financial constraints and pulled by curiosity about international education. These insights extended the refined push–pull model by applying it to non-mobile students and emphasising the role of individual-level factors in choosing study destinations. Moreover, the findings highlighted the necessity for TNHE institutions to adopt flexible approaches to thrive in the competitive postgraduate education market.

[FREE E-PRINT LINK] https://www.tandfonline.com/eprint/XWFX9YPNSN8ZSD7N4DJT/full?target=10.1080/07294360.2026.2654612
Original languageEnglish
JournalHigher Education Research and Development
Publication statusPublished - Mar 2026

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