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Low-Temperature Synthesis of Wafer-Scale MoS2-WS2Vertical Heterostructures by Single-Step Penetrative Plasma Sulfurization

  • Hyunho Seok
  • , Yonas Tsegaye Megra
  • , Chaitanya K. Kanade
  • , Jinill Cho
  • , Vinit K. Kanade
  • , Minjun Kim
  • , Inkoo Lee
  • , Pil J. Yoo
  • , Hyeong U. Kim*
  • , Ji Won Suk*
  • , Taesung Kim*
  • *Corresponding author for this work
  • Sungkyunkwan University
  • School of Mechanical Engineering
  • Korea Institute of Machinery and Materials

Research output: Contribution to journalArticlepeer-review

77 Citations (Scopus)

Abstract

Two-dimensional (2D) transition metal dichalcogenides (TMDs) have attracted considerable attention owing to their synergetic effects with other 2D materials, such as graphene and hexagonal boron nitride, in TMD-based heterostructures. Therefore, it is important to understand the physical properties of TMD-TMD vertical heterostructures for their applications in next-generation electronic devices. However, the conventional synthesis process of TMD-TMD heterostructures has some critical limitations, such as nonreproducibility and low yield. In this paper, we synthesize wafer-scale MoS2-WS2 vertical heterostructures (MWVHs) using plasma-enhanced chemical vapor deposition (PE-CVD) via penetrative single-step sulfurization discovered by time-dependent analysis. This method is available for fabricating uniform large-area vertical heterostructures (4 in.) at a low temperature (300 °C). MWVHs were characterized using various spectroscopic and microscopic techniques, which revealed their uniform nanoscale polycrystallinity and the presence of vertical layers of MoS2 and WS2. In addition, wafer-scale MWVHs diodes were fabricated and demonstrated uniform performance by current mapping. Furthermore, mode I fracture tests were performed using large double cantilever beam specimens to confirm the separation of the MWVHs from the SiO2/Si substrate. Therefore, this study proposes a synthesis mechanism for TMD-TMD heterostructures and provides a fundamental understanding of the interfacial properties of TMD-TMD vertical heterostructures.

Original languageEnglish
Pages (from-to)707-718
Number of pages12
JournalACS Nano
Volume15
Issue number1
DOIs
Publication statusPublished - 26 Jan 2021
Externally publishedYes

Keywords

  • adhesion energy
  • dry transfer
  • heterostructure
  • plasma-enhanced chemical vapor deposition (PE-CVD)
  • transition metal dichalcogenides (TMDs)

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