Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology

Zijin JIANG; Rui Yao; Miao Cui; Zhao Wang; Sang Lam; Stephen Taylor

Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology

Zijin JIANG^*
, Rui Yao^*
, Miao Cui
, Zhao Wang
, Sang Lam^*
, Stephen Taylor

^*Corresponding author for this work

Xi'an Jiaotong‐Liverpool University
Department of Electrical Engineering and Electronics
University of Liverpool, UK

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 22 Oct 2024
Event	2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology - Zhuhai, China Duration: 22 Oct 2024 → 25 Oct 2024 https://www.icsict.com/

Conference

Conference	2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology
Abbreviated title	ICSICT 2024
Country/Territory	China
City	Zhuhai
Period	22/10/24 → 25/10/24
Internet address	https://www.icsict.com/

Electromagnetic Investigation of Substrate Coupling in Gallium Nitride (GaN) Power Integrated Circuits
Lam, S. (Supervisor)
1 Dec 2023 → 30 Nov 2026
Activity: Supervision › PhD Supervision

Cite this

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title = "Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology",

author = "Zijin JIANG and Rui Yao and Miao Cui and Zhao Wang and Sang Lam and Stephen Taylor",

year = "2024",

month = oct,

day = "22",

language = "English",

note = "2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024 ; Conference date: 22-10-2024 Through 25-10-2024",

url = "https://www.icsict.com/",

}

TY - CONF

T1 - Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology

AU - JIANG, Zijin

AU - Yao, Rui

AU - Cui, Miao

AU - Wang, Zhao

AU - Lam, Sang

AU - Taylor, Stephen

PY - 2024/10/22

Y1 - 2024/10/22

M3 - Paper

T2 - 2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology

Y2 - 22 October 2024 through 25 October 2024

ER -

Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology

Conference

Activities

Electromagnetic Investigation of Substrate Coupling in Gallium Nitride (GaN) Power Integrated Circuits

Cite this