Fingerprint
Dive into the research topics of 'High-isolation bonding pad design for silicon RFIC up to 20 GHz'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
High-isolation bonding pad design for silicon RFIC up to 20 GHz
Sang Lam*, Philip K.T. Mok, Ping K. Ko, Mansun Chan
*Corresponding author for this work
Research output: Contribution to journal › Letter › peer-review
9
Citations
(Scopus)