Enhancement of the adhesion energy between monolayer graphene and SiO2 by thermal annealing

Yonas Tsegaye Megra; Soomook Lim; Tae Gyeong Lim; Seung Ryul Na; Ji Won Suk

doi:10.1016/j.apsusc.2021.151243

Enhancement of the adhesion energy between monolayer graphene and SiO₂ by thermal annealing

Yonas Tsegaye Megra
, Soomook Lim
, Tae Gyeong Lim
, Seung Ryul Na
, Ji Won Suk^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

Because graphene is placed on a rigid or flexible substrate for future applications such as transparent or flexible electronic devices, the interfacial characteristics between graphene and the underlying substrate are of great importance for developing mechanically and electrically reliable devices. In this work, the interaction strength of large-area monolayer graphene transferred on SiO₂/Si was adjusted by thermal treatments, and its adhesion energy was measured by mode I fracture tests using a double cantilever beam (DCB) configuration with a laminated composite (Si/SiO₂/graphene/epoxy/SiO₂/Si). Mechanical delamination of monolayer graphene from SiO₂ showed an adhesion energy of 1.5 ± 0.15 J/m². It was found that thermal annealing of graphene on SiO₂ at 300 and 450 °C increased the adhesion energy to 2.2 ± 0.20 and 4.6 ± 0.31 J/m², respectively. Characterization of graphene on SiO₂ using atomic force microscopy and Raman spectroscopy revealed that the enhanced adhesion energy was attributed to the improved conformal contacts of monolayer graphene with corrugated SiO₂ surfaces.

Original language	English
Article number	151243
Journal	Applied Surface Science
Volume	570
DOIs	https://doi.org/10.1016/j.apsusc.2021.151243
Publication status	Published - 30 Dec 2021
Externally published	Yes

Keywords

Adhesion energy
Fracture test
Graphene
Silicon oxide
Thermal annealing

Access to Document

10.1016/j.apsusc.2021.151243

Cite this

@article{92e7a9530d6e47f5b1d0151cef9b2b11,

title = "Enhancement of the adhesion energy between monolayer graphene and SiO2 by thermal annealing",

abstract = "Because graphene is placed on a rigid or flexible substrate for future applications such as transparent or flexible electronic devices, the interfacial characteristics between graphene and the underlying substrate are of great importance for developing mechanically and electrically reliable devices. In this work, the interaction strength of large-area monolayer graphene transferred on SiO2/Si was adjusted by thermal treatments, and its adhesion energy was measured by mode I fracture tests using a double cantilever beam (DCB) configuration with a laminated composite (Si/SiO2/graphene/epoxy/SiO2/Si). Mechanical delamination of monolayer graphene from SiO2 showed an adhesion energy of 1.5 ± 0.15 J/m2. It was found that thermal annealing of graphene on SiO2 at 300 and 450 °C increased the adhesion energy to 2.2 ± 0.20 and 4.6 ± 0.31 J/m2, respectively. Characterization of graphene on SiO2 using atomic force microscopy and Raman spectroscopy revealed that the enhanced adhesion energy was attributed to the improved conformal contacts of monolayer graphene with corrugated SiO2 surfaces.",

keywords = "Adhesion energy, Fracture test, Graphene, Silicon oxide, Thermal annealing",

author = "Megra, \{Yonas Tsegaye\} and Soomook Lim and Lim, \{Tae Gyeong\} and Na, \{Seung Ryul\} and Suk, \{Ji Won\}",

note = "Publisher Copyright: {\textcopyright} 2021 Elsevier B.V.",

year = "2021",

month = dec,

day = "30",

doi = "10.1016/j.apsusc.2021.151243",

language = "English",

volume = "570",

journal = "Applied Surface Science",

issn = "0169-4332",

}

TY - JOUR

T1 - Enhancement of the adhesion energy between monolayer graphene and SiO2 by thermal annealing

AU - Megra, Yonas Tsegaye

AU - Lim, Soomook

AU - Lim, Tae Gyeong

AU - Na, Seung Ryul

AU - Suk, Ji Won

PY - 2021/12/30

Y1 - 2021/12/30

N2 - Because graphene is placed on a rigid or flexible substrate for future applications such as transparent or flexible electronic devices, the interfacial characteristics between graphene and the underlying substrate are of great importance for developing mechanically and electrically reliable devices. In this work, the interaction strength of large-area monolayer graphene transferred on SiO2/Si was adjusted by thermal treatments, and its adhesion energy was measured by mode I fracture tests using a double cantilever beam (DCB) configuration with a laminated composite (Si/SiO2/graphene/epoxy/SiO2/Si). Mechanical delamination of monolayer graphene from SiO2 showed an adhesion energy of 1.5 ± 0.15 J/m2. It was found that thermal annealing of graphene on SiO2 at 300 and 450 °C increased the adhesion energy to 2.2 ± 0.20 and 4.6 ± 0.31 J/m2, respectively. Characterization of graphene on SiO2 using atomic force microscopy and Raman spectroscopy revealed that the enhanced adhesion energy was attributed to the improved conformal contacts of monolayer graphene with corrugated SiO2 surfaces.

AB - Because graphene is placed on a rigid or flexible substrate for future applications such as transparent or flexible electronic devices, the interfacial characteristics between graphene and the underlying substrate are of great importance for developing mechanically and electrically reliable devices. In this work, the interaction strength of large-area monolayer graphene transferred on SiO2/Si was adjusted by thermal treatments, and its adhesion energy was measured by mode I fracture tests using a double cantilever beam (DCB) configuration with a laminated composite (Si/SiO2/graphene/epoxy/SiO2/Si). Mechanical delamination of monolayer graphene from SiO2 showed an adhesion energy of 1.5 ± 0.15 J/m2. It was found that thermal annealing of graphene on SiO2 at 300 and 450 °C increased the adhesion energy to 2.2 ± 0.20 and 4.6 ± 0.31 J/m2, respectively. Characterization of graphene on SiO2 using atomic force microscopy and Raman spectroscopy revealed that the enhanced adhesion energy was attributed to the improved conformal contacts of monolayer graphene with corrugated SiO2 surfaces.

KW - Adhesion energy

KW - Fracture test

KW - Graphene

KW - Silicon oxide

KW - Thermal annealing

UR - https://www.scopus.com/pages/publications/85114813062

U2 - 10.1016/j.apsusc.2021.151243

DO - 10.1016/j.apsusc.2021.151243

M3 - Article

AN - SCOPUS:85114813062

SN - 0169-4332

VL - 570

JO - Applied Surface Science

JF - Applied Surface Science

M1 - 151243

ER -

Enhancement of the adhesion energy between monolayer graphene and SiO₂ by thermal annealing

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this