TY - GEN
T1 - Embodied AI Through Cloud-Fog Computing
T2 - 33rd International Symposium on Industrial Electronics, ISIE 2024
AU - Hu, Dongxiao
AU - Lan, Dapeng
AU - Liu, Yu
AU - Ning, Jiahong
AU - Wang, Jia
AU - Yang, Yun
AU - Pang, Zhibo
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Embodied AI represents a crucial step towards achieving Artificial General Intelligence (AGI). The next paradigm of Embodied AI involves physical embodiment, enhanced perception capabilities, and adaptive automation. This advances the field significantly, paving the way for broader expansion. Despite the significant progress, existing computing frameworks, like local computation or cloud computing, struggle to meet the substantial demands of Embodied AI. The Cloud-Fog Embodied framework, namely based on CFA (cloud-fog automation) offers a promising solution to address these challenges. Our goal is to drive integration across multiple domains, including AI, robotics and industrial production, to tackle multifaceted challenges and seize opportunities to achieve AGI in the future.
AB - Embodied AI represents a crucial step towards achieving Artificial General Intelligence (AGI). The next paradigm of Embodied AI involves physical embodiment, enhanced perception capabilities, and adaptive automation. This advances the field significantly, paving the way for broader expansion. Despite the significant progress, existing computing frameworks, like local computation or cloud computing, struggle to meet the substantial demands of Embodied AI. The Cloud-Fog Embodied framework, namely based on CFA (cloud-fog automation) offers a promising solution to address these challenges. Our goal is to drive integration across multiple domains, including AI, robotics and industrial production, to tackle multifaceted challenges and seize opportunities to achieve AGI in the future.
KW - agent
KW - cloud-fog automation
KW - Embodied AI
KW - pretrained foundation models
UR - https://www.scopus.com/pages/publications/85199610714
U2 - 10.1109/ISIE54533.2024.10595837
DO - 10.1109/ISIE54533.2024.10595837
M3 - Conference Proceeding
AN - SCOPUS:85199610714
T3 - IEEE International Symposium on Industrial Electronics
BT - 2024 33rd International Symposium on Industrial Electronics, ISIE 2024 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 June 2024 through 21 June 2024
ER -