Abstract
We report computational electromagnetic (EM) investigation of silicon nitride (Si3N4) optical waveguides with CMOS-compatible manufacturing for ultimate optoelectronic integration on Si. By computing the electric field profiles of the fundamental mode of the Si3N4 optical waveguides, it is found about the fabrication need of 4 µm or thicker SiO2 under-cladding layer, so as to minimise EM power loss to the resistive Si substrate. Low- or medium-resistivity (down to 0.5 Ω.cm) Si wafers are suitable choices.
| Original language | English |
|---|---|
| Title of host publication | 9th IEEE Electron Devices Technology and Manufacturing Conference |
| Subtitle of host publication | Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9798331504168 |
| DOIs | |
| Publication status | Published - 2025 |
| Event | 9th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2025 - Hong Kong, Hong Kong Duration: 9 Mar 2025 → 12 Mar 2025 |
Conference
| Conference | 9th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2025 |
|---|---|
| Country/Territory | Hong Kong |
| City | Hong Kong |
| Period | 9/03/25 → 12/03/25 |
Keywords
- integrated silicon microphotonics
- silicon base wafer
- silicon dioxide cladding
- Silicon nitride optical waveguides
- substrate conductivity
Fingerprint
Dive into the research topics of 'CMOS-compatible Si3N4 Optical Waveguides: An Electromagnetic Study for Fabrication Considerations of SiO2 Cladding and Silicon Wafer Choice'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver