Project Details
Project Title (In Chinese)
芯片封装中Underfill胶
Fund Amount (RMB)
50000.00
| Project Category | Technical Consultation |
|---|---|
| Status | Finished |
| Effective start/end date | 5/05/25 → 4/10/25 |
Collaborative partners
- Xi'an Jiaotong-Liverpool University (lead)
- DEEPVERSE (SHANGHAI) LTD (Project partner)
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