The Development of Protective Coatings and Failure Mechanism Research for Reliability Testing Probes in Advanced Multi-Chiplet Integrated Packaging Chips

Project: Collaborative Research Project

Project Details

Project Title (In Chinese)

多芯粒集成先进封装芯片可靠性测试探针的防护涂层开发与失效机理研究

Fund Amount (RMB)

500000.00
Project CategoryTechnology Development (Commissioned Party)
StatusActive
Effective start/end date1/07/2430/06/27

Collaborative partners

Fingerprint

Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.