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Research on Spatial Power Combining Technology for High-Power Arrayed Chip Integration

Project: Internal Research Project

Project Details

Project Title (In Chinese)

高功率阵列芯片集成中的空间功率合成技术研究

Fund Amount (RMB)

100000.00
Project CategoryRDF-A
StatusActive
Effective start/end date1/01/2631/12/28