Skip to main navigation Skip to search Skip to main content

Research and development of a die bonding system and control algorithm

Project: Collaborative Research Project

Project Details

Project Title (In Chinese)

贴片系统及控制算法研发

Fund Amount (RMB)

1175000
StatusFinished
Effective start/end date1/07/2231/07/23

Fingerprint

Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.