| Period | 1 Dec 2023 → 30 Nov 2026 |
|---|---|
| Degree of Recognition | International |
Related content
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Projects
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Electromagnetic Investigation of Substrate Coupling in Gallium Nitride (GaN) Power Integrated Circuits
Project: Internal Research Project
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Research output
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Substrate Coupling in SOI Technology: An Electromagnetic Study for RF Integrated Circuit Design & Manufacturing
Research output: Contribution to conference › Paper › peer-review
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On the Design and Effectiveness of Isolation Trenches to Suppress Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology
Research output: Contribution to conference › Paper › peer-review
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Electromagnetic Investigation of Substrate Coupling in Power Integrated Circuits on GaN-on-Si Technology
Research output: Contribution to conference › Paper › peer-review
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Impact of the Resistive Silicon Base Wafer on Substrate Coupling in Power Integrated Circuits in GaN-on-Si Technology
Research output: Contribution to conference › Paper › peer-review